Iigesi ze-Ultra-high purity (UHP) zingubomi boshishino lwe-semiconductor. Njengoko imfuno engazange ibonwe kunye nokuphazamiseka kumakhonkco onikezelo lwehlabathi kunyusa amaxabiso egesi yoxinzelelo oluphezulu, uyilo olutsha lwe-semiconductor kunye nezenzo zokuvelisa zonyusa inqanaba lolawulo longcoliseko olufunekayo. Kubavelisi be-semiconductor, ukukwazi ukuqinisekisa ukucoceka kwegesi ye-UHP kubaluleke kakhulu kunangaphambili.

Iigesi zeUltra High Purity (UHP) zibaluleke kakhulu kuMveliso wangoku weSemiconductor

Esinye sezicelo eziphambili zegesi ye-UHP yi-inertization: igesi ye-UHP isetyenziselwa ukubonelela umoya okhuselayo ojikeleze amacandelo e-semiconductor, ngaloo ndlela ubakhusela kwimiphumo eyingozi yokufuma, i-oksijeni kunye nezinye izinto ezingcolileyo emoyeni. Nangona kunjalo, i-inertization ngomnye wemisebenzi emininzi eyahlukeneyo eyenziwa yigesi kwishishini le-semiconductor. Ukusuka kwiigesi zeplasma eziphambili ukuya kwiigesi ezisebenzayo ezisetyenziswa ekufakeni nasekufakeni amanzi, iigesi zoxinzelelo oluphezulu zisetyenziselwa iinjongo ezininzi ezahlukeneyo kwaye ziyimfuneko kulo lonke ikhonkco lokubonelela nge-semiconductor.

Ezinye zeegesi "ezingundoqo" kwishishini le-semiconductor ziqukainitrogen(isetyenziswa njengokucoca jikelele kunye negesi engasebenziyo),iargon(isetyenziswa njengerhasi yeplasma ephambili kwi-etching kunye ne-deposition reactions),i-helium(isetyenziswa njengerhasi engasebenziyo eneempawu ezikhethekileyo zokuhambisa ubushushu) kunyeihydrogen(udlala iindima ezininzi kwi-annealing, deposition, epitaxy kunye nokucoca iplasma).

Njengoko itekhnoloji ye-semiconductor iye yavela kwaye yatshintsha, kunjalo neegesi ezisetyenziswa kwinkqubo yokuvelisa. Namhlanje, izityalo zokuvelisa i-semiconductor zisebenzisa uluhlu olubanzi lweegesi, ukusuka kwiigesi ezintle ezifanaikriptonikwayeneonkwiintlobo ezisebenzayo ezifana ne-nitrogen trifluoride (NF 3 ) kunye ne-tungsten hexafluoride (WF 6).

Ukukhula kwemfuno yobunyulu

Ukususela ekuqulunqweni kwe-microchip yokuqala yorhwebo, ihlabathi liye labona ukwanda okumangalisayo okukufutshane-okubonakalayo ekusebenzeni kwezixhobo ze-semiconductor. Kule minyaka mihlanu idlulileyo, enye yeendlela eziqinisekileyo zokuphumeza olu hlobo lophuculo lwentsebenzo ibe “ngokulinganisa ubungakanani”: ukunciphisa imilinganiselo ephambili yoyilo lwe-chip esele lukhona ukuze kucudiswe ii-transistors ezininzi kwindawo enikiweyo. Ukongeza koku, uphuhliso lwezakhiwo ezintsha ze-chip kunye nokusetyenziswa kwezixhobo ezinqamlekileyo ziye zavelisa ukuxhuma ekusebenzeni kwesixhobo.

Namhlanje, imilinganiselo ebalulekileyo yee-semiconductors ezisikiweyo ngoku zincinci kangangokuba ukukala ubungakanani akuseyona ndlela isebenzayo yokuphucula ukusebenza kwesixhobo. Endaweni yoko, abaphandi be-semiconductor bafuna izisombululo ngendlela yezixhobo zenoveli kunye ne-3D chip architectures.

Amashumi eminyaka oyilo ngokutsha olungakhathali luthetha ukuba izixhobo zanamhlanje ze-semiconductor zinamandla kakhulu kunee-microchips zakudala - kodwa zibuthathaka ngakumbi. Ukufika kobuchwephesha bokwenziwa kwe-wafer eyi-300mm kunyuse inqanaba lolawulo lokungacoceki olufunekayo kwimveliso ye-semiconductor. Nokuba ukungcoliseka okuncinci kwinkqubo yokuvelisa (ingakumbi inqabileyo okanye i-inert gases) kunokukhokelela ekungaphumelelini kwezixhobo eziyingozi - ngoko ke ukucoceka kwegesi kubaluleke kakhulu kunanini ngaphambili.

Kwiplanti yokwenziwa kwesemiconductor eqhelekileyo, igesi ephezulu-yobunyulu sele iyeyona nkcitho inkulu emva kwesilicon ngokwayo. Ezi ndleko kulindeleke ukuba zonyuke kuphela njengoko imfuno yee-semiconductors inyukela kubude obutsha. Iziganeko zaseYurophu zibangele ukuphazamiseka okongeziweyo kwimarike yegesi yendalo exineneyo kakhulu. I-Ukraine yenye yezona zikhulu zehlabathi zokuthumela ngaphandle eziphezuluneoniimpawu; Uhlaselo lwaseRussia luthetha ukuba ukuhanjiswa kwerhasi enqabileyo kuyathintelwa. Oku kubangele ukunqongophala kunye namaxabiso aphezulu kwezinye iigesi ezihloniphekileyo ezifanaikriptonikwayexenon.