Iigesi zokucoca okuphezulu kakhulu (UHP) zibalulekile kushishino lwe-semiconductor. Njengoko imfuno engakaze ibonwe ngaphambili kunye nokuphazamiseka kweenkqubo zokubonelela ngeenkonzo zehlabathi zinyusa ixabiso legesi yoxinzelelo oluphezulu kakhulu, uyilo olutsha lwe-semiconductor kunye neendlela zokwenza izinto ziyandisa inqanaba lolawulo longcoliseko olufunekayo. Kubavelisi be-semiconductor, ukukwazi ukuqinisekisa ubunyulu begesi ye-UHP kubaluleke kakhulu kunangaphambili.

Iigesi ze-Ultra High Purity (UHP) zibaluleke kakhulu kwiMveliso yeSemiconductor yanamhlanje

Enye yezona ndlela ziphambili zokusetyenziswa kwegesi ye-UHP kukungangenisi: Igesi ye-UHP isetyenziselwa ukubonelela ngomoya okhuselayo ojikeleze izinto ze-semiconductor, ngaloo ndlela izikhusela kwimiphumo eyingozi yokufuma, ioksijini kunye nezinye izinto ezingcolisayo emoyeni. Nangona kunjalo, ukungangenisi ngomnye wemisebenzi emininzi eyahlukeneyo eyenziwa ziigesi kwishishini le-semiconductor. Ukususela kwiigesi zeplasma eziphambili ukuya kwiigesi ezisebenzayo ekutshiseni nasekutsaleni, iigesi zoxinzelelo oluphezulu kakhulu zisetyenziselwa iinjongo ezahlukeneyo kwaye zibalulekile kulo lonke uthotho lobonelelo lwe-semiconductor.

Ezinye zeegesi "eziphambili" kwishishini le-semiconductor ziqukai-nitrogen(isetyenziswa njengokucoca ngokubanzi kunye negesi engasebenziyo),i-argon(isetyenziswa njengegesi ephambili yeplasma kwiimpendulo zokugrumba kunye nokufaka),i-helium(isetyenziswa njengegesi engasebenziyo eneempawu ezikhethekileyo zokudlulisa ubushushu) kunyei-hydrogen(udlala iindima ezininzi ekutsaleni, ekubekeni, epitaxy kunye nokucoca iplasma).

Njengoko iteknoloji ye-semiconductor itshintshile kwaye itshintshile, neegesi ezisetyenziswayo kwinkqubo yokuvelisa ziye zatshintsha. Namhlanje, izityalo zokwenza i-semiconductor zisebenzisa uluhlu olubanzi lweegesi, ukusuka kwiigesi ezintle ezifanaiKryptonkwayei-neonkwiintlobo ezisabelayo ezifana ne-nitrogen trifluoride (NF3) kunye ne-tungsten hexafluoride (WF6).

Imfuno ekhulayo yobunyulu

Ukususela ekuvelisweni kwe-microchip yokuqala yorhwebo, ihlabathi libone ukwanda okumangalisayo kokusebenza kwezixhobo ze-semiconductor. Kwiminyaka emihlanu edlulileyo, enye yezona ndlela ziqinisekileyo zokufezekisa olu hlobo lophuculo lokusebenza ibe kuku "linganisa ubungakanani": ukunciphisa ubukhulu obuphambili bezakhiwo ze-chip ezikhoyo ukuze kucinezelwe ii-transistors ezininzi kwindawo ethile. Ukongeza koku, uphuhliso lwezakhiwo ze-chip ezintsha kunye nokusetyenziswa kwezinto eziphambili kuye kwavelisa utshintsho olukhulu ekusebenzeni kwesixhobo.

Namhlanje, ubukhulu obubalulekileyo bee-semiconductors eziphambili ngoku buncinci kangangokuba ukulinganiswa kobukhulu akuseyona ndlela isebenzayo yokuphucula ukusebenza kwesixhobo. Endaweni yoko, abaphandi be-semiconductor bafuna izisombululo ngendlela yezixhobo ezintsha kunye noyilo lwe-3D chip.

Uyilo olutsha olungenamda lweminyaka emininzi luthetha ukuba izixhobo ze-semiconductor zanamhlanje zinamandla kakhulu kunee-microchips zakudala - kodwa zikwabuthathaka ngakumbi. Ukufika kwetekhnoloji yokwenza i-wafer ye-300mm kunyuse izinga lolawulo lokungcola olufunekayo kwimveliso ye-semiconductor. Nokuba ungcoliseko oluncinci kwinkqubo yokuvelisa (ingakumbi iigesi ezinqabileyo okanye ezingasebenziyo) lunokubangela ukusilela okukhulu kwezixhobo - ngoko ke ubunyulu begesi ngoku bubaluleke ngakumbi kunangaphambili.

Kwisityalo esiqhelekileyo sokwenza i-semiconductor, igesi ecocekileyo kakhulu sele yeyona ibiza kakhulu emva kwe-silicon ngokwayo. Ezi ndleko kulindeleke ukuba zinyuke njengoko imfuno yee-semiconductors inyuka iye kwinqanaba elitsha. Iziganeko eYurophu zibangele ukuphazamiseka okungakumbi kwimarike yegesi yendalo enoxinzelelo olukhulu kakhulu. I-Ukraine yenye yezona nkampani zithumela ngaphandle ezinkulu kwihlabathi ezicocekileyo kakhulu.i-neonimiqondiso; Ukuhlasela kweRashiya kuthetha ukuba ukuhanjiswa kwegesi engaqhelekanga kuyathintelwa. Oku kwakhokelela ekunqongophaleni nasekunyukeni kwamaxabiso ezinye iigesi ezintle ezifanaiKryptonkwayei-xenon.